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What's New Link 

What's New
Andrew NDT on Design News magazine

People Link 

Application in CMP process
Monitoring CMP in real time with Eddy current

Projects Link 

Products
The latest products

Services Link 

Services
Our superior services

3 D Contour Map

Click below to see the 81 points 3D Contour Map from our TFEM software

Matlab 3D

ML 3D

Matlab Top View

ML Top View

Matlab Side View

ML Side View

Open GL 3D

OGL 3D

Open GL Top View

OGL Top View

Open GL Side View

OGL Side View

Attention

Andrew NDT on Design News magazine

Presentation slide show 1

 

Slide show 1 (PDF)

Presentation slide show 2

 

Slide show 2 (PDF)

Our brochure in PDF format

Our Patents

US6407546.pdf

US6407546.PDF

 

US 6407546          (US pattern website link)

US6549006.pdf

US6549006.PDF

 

US 6549006          (US pattern website link)

Please email us to receive a copy of our catalog

Andrew NDT Engineering
1816 Club Drive
Gilroy, Ca 95020
Phone 408-710-0342
Fax 408-842-1329
Cuongle@andrewndt.com

Toll free: 1-888-606-1166

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Our Eddy Current probes and eddy current PC Windows are designed and manufactured with unique advance technology. We invite youto join us in the new era of advanced technology in Eddy-Current Instrumentation and semiconductor equipment

Our Eddy-Current Inspection System integrates eddy-current nondestructive testing technology with a full spectrum of inspection solutions ranging from state-of-the-art Hardware/Software products to Automated Inspection for tube inspection and semiconductor equipment

The Andrew NDT Engineering Staff is composed of metallurgical, electronic, NDT, mechanical and software engineers, machinists, probe designers, and assemblers

Our ET Inspection System Specialists are dedicated to providing our customer with:

  • A cost effective eddy-current Inspection System Development Plan
  • PC-based software/hardware integration of the Eddy-Current Inspection System
  • Eddy current engineering solution ranging from probe design to automated inspection system
  • Eddy current component design solutions for probes, fixtures, standards, equipment, hardware/software and motion control
  • Full service product technical support

Andrew NDT Engineering's Advanced ET Technological Solutions:

  • Stand-Alone system for 200 mm and 300 mm wafer thickness measurement.
  • Table-Top system for 200 mm and 300 mm wafer thickness measurement
  • Integration-Module for 200 mm and 300 mm wafer thickness measurement.
  • State-of-the-art integration of the Eddy-Current Inspection System featuring a 28 feet-per-second hyper-speed inspection capability for tube inspection
  • Remote ET Field solution for the "blind zone" support-sheet problem
  • PC Board producing a 20 Volt peak-to-peak and 50 milli-ampere output achieving a remote field ET probe penetration up to 0.300 inch while maintaining a through-tube-hole detection capacity of 0.062 inch
  • PC-based Probe Characterization System determines the optimum operating frequency and range of the individual probe, thus yielding highly refined control of the basic electronic characteristics of reactance, resistance and inductance

Table-Top with three axis

Integration-Module

Stand-Alone, fully automated

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