Andrew NDT no-touch testing article on Design News magazine Design News magazine has written an article about "How this wafer tester gets precision motion using motionless
feedback" for Andrew NDT Engineering. Our technologies based on the proximity sensor to keep a fixed distance between our sensors and the surface of the wafer. Therefore we can deliver the superior result in
terms of stability, repeatability and accuracy.Read more >> Eddy current technology to monitor CMP in real time
Monitoring copper removal rate, or end point detection in CMP processes, is a critical element in any CMP tool. Almost every CMP tool
manufacturer faces this problem. Some use an optical technique to detect end points, some use an eddy current technique to measure removal rates, but none of the CMP tool manufacturers are capable of delivering a
completely controllable CMP system to the end user. As a result, some find a different direction to avoid CMP processes due to high stress on low K materials or attempt to use a different pad, a different slurry, a
different pressure, a different tool design, etc. Regardless of the CMP process or non-CMP process, such as reversing current to remove copper, a closed loop feed back system in real time used to control the copper rate
removal or end point detection is still a must in the control process.
Read more >>Andrew NDT expands the Sale Network around the world After the Semicon West trade show, Sales Representatives around the world working with Andrew NDT Engineering to create a very strong Sale Network to reach potential businesses
abroad.Andrew NDT at Semicon West July 14-16, 2003Andrew NDT Engineering booth at Semicon West Wafer Processing attracted many potential customers, investors, sale representatives and partners. One thing special about our
booth in Semicon West that made us stand out from other is that we had all of our products running on the spot collecting data and displaying in real time the result of the 81 or 49 points thickness measument
result in 3 D Open GL graphic to our customer. Read more ... Stand alone system for 300 mm and 200 mm copper wafer
The stand-alone system is up and running 24/7 and it is ready to ship now.Table top system for 300 mm and 200 mm copper wafer, ready to shipThe table-top system is up and running 24/7
to test for reliability now. It comes with 1, 2 or 3 axis.
- The 3 axis table top can measure anywhere on the wafer.
- The 2 axis table top can be used with our 16 probe array to measure any cross-section on the wafer
- The 1 axis table top can be used to measure with single
probe or 16 probe array
Portable systemThe portable system uses the core technology common to all of our systems. It can be used in a number of different applications including wafer thickness measurement. The
unit is portable so it is well suited to field test and research applications. The traditional eddy-current measurement techniques require the user to NULL the reference signal once in awhile and recalibrate
very often. Our multi-frequency eddy-current techniques provide the most accurate readings and do not require user to NULL the reference signal. Moreover, recalibration is rarely needed - once a shift is
recommended and takes only a few minutes - and does not rely on the NULL reference point to calculate the result.
Integration moduleThe Integration module is ready to ship now. It has one axis and an array of 16 probes to measure the cross section of the
wafer in one shot. Each probe takes less than 50 msec to measure and less than 1 sec to switch between probes. However we can add more probes to measure the whole wafer surface if needed to generate a 3
dimensional view of the wafer metal layer thickness. Its form factor is very compact so it can be snapped into a very small space. It comes with the very compact ethernet motion control blocks from
Galil but the PCI motion control card version is also available.Core technologyTurn on your computer to achieve The Most Sophisticated Eddy Current Instrumentation In the World with the ANDT-2001F board |
