|
 |
 |
|
|
Products Overview
We offer a variety of products based on a superior nondestructive eddy-current
measurement technology. These products range from Tube Inspection, Eddy Current Instrumentation, and Standard Probes to Special-Application ProbesOur TFEM system can be used to measure metal layer
thickness on silicon wafers with up to 50 Angstrom accuracy and repeatability. Three models -- table-top
, stand-alone and integration-module -- provide the customer with a wide variety of options for measuring metal layer thickness for different needs.The table-top
is suitable for small R&D lab where customer can insert one wafer at a time by hand to measure any point on the wafer. The stand-alone
system is a fully automated system with a separate calibration station. This contains a calibration wafer cassette for occasional recalibration without changing the cassette.The integration-module
is ready to be integrated to any fully automated system for different purpose, such as process control feedback.The portable
is mainly for aerospace and tube inspection where field service worker has to carry it to the field to inspect the defect. |
|
|
|
|
|
|
|
Select one of the following product links to keep up to date with the most current products in the works.
|
|
|
