The table top default configuration has 1 probe to measure any selected points on the wafer. It can measure up to:
- 49 points on the 200 mm wafer
- 81 points on the 300 mm wafer.
Or in cross section mode, it measures a set of points across the diameter to inspect the metal layer thickness profile of the wafer:
- One cross section at a time
- Multiple cross sections with different angle.
For example it can measure a set of 9 point across the diameter of the wafer then turn 30 degree and measure another set of 9 point.
However, it can also be configured with an array of 16 probes to measure the
cross section simultaneously.
The default configuration has 3 axis but it can be configured with 2 axis, or just 1 axis depending on the customer need.
This system is designed to be suitable for R&D facility
since the wafer has to be loaded manually. It can also be snapped into a much larger system as an integrated module for a fully automated stand-alone system as well. In fact, it fits into our fully automated
stand-alone system.
Our designs are plug-and-play component modules that can be put together as a fully automated system, or a scaled down table top system, or a portable system. They are upgradeable as
well. Customer can upgrade from one axis to 3 axis by snapping in 2 more axis without changing anything. For example, if the table is part of the stand-alone system, changing from 1 axis to 3 axis does
not change the interface between the table top and the rest of the system. The wafer chuck is still in the same position whether the table top has 1, 2 or 3 axis. Therefore upgrading from 1 axis to 3 axis is
as easy as snap in the 3 axis system to replace the 1 axis system.
